Complex cavity formation in molded packaging structures

ABSTRACT

Molded electronics package cavities are formed by placing a sacrificial material in the mold and then decomposing, washing, or etching away this sacrificial material. The electronics package that includes this sacrificial material is then overmolded, with little or no change needed in the overmolding process. Following overmolding, the sacrificial material is removed such as using a thermal, chemical, optical, or other decomposing process. This proposed use of sacrificial material allows for formation of complex 3-D cavities, and reduces or eliminates the need for precise material removal tolerances. Multiple instances of the sacrificial material may be removed simultaneously, replacing a serial drilling process with a parallel material removal manufacturing process.

TECHNICAL FIELD

Embodiments described herein generally relate to formation of complexcavities in molded electronic package structures.

BACKGROUND

There is an increasing demand and need for wearable devices, small formfactor devices, and device-to-device communications (e.g., Internet ofThings (IoT)), there is growing demand and need for applying a mold toelectronics packages to form an overmolded electronics package. Packagesmay be overmolded for many reasons. Overmolding a package can providevarious desirable properties, such as mechanical strength, thickness, ora layer to reduce accidental electrostatic discharge (ESD). Mechanicalstrength may be desirable for an otherwise fragile package. Strength,thickness, or ESD insulation may improve the ability to handle variouspackages, especially very thin packages. An overmold may serve toprotect integrated circuit (IC) dies or passive electronic components ona package. Packages can be overmolded to obscure which electronicscomponents are used, for aesthetic purposes, or to enable marking fortracking or authenticity detection.

While package overmolding provides various useful functions, packageovermolding also undesirably increases the package height (e.g.,z-height), often without adding increased electrical functionality.Additionally, some components require exposure, such as sensors orconnectors, but these components may be obstructed by an overmold.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A-1D are block diagrams of sacrificial material cavity formation,in accordance with at least one embodiment of the invention.

FIG. 2 is a block diagram of complex channel cavity formation, inaccordance with at least one embodiment of the invention.

FIGS. 3A-3B are a block diagrams of a cavity formation application, inaccordance with at least one embodiment of the invention.

FIG. 4A-4C are block diagrams of complex cavity formation, in accordancewith at least one embodiment of the invention.

FIG. 5 is a flowchart of a complex cavity application method, inaccordance with at least one embodiment of the invention.

FIG. 6 is a block diagram of an electronic device incorporating acomplex cavity apparatus or method in accordance with at least oneembodiment of the invention.

DESCRIPTION OF EMBODIMENTS

Some solutions for creating openings in molded packages include lasercutting or mechanical drilling. These solutions may be augmented byusing a molding enclosure (e.g., mold chase) that creates a surfacevacancy using enclosure surface features, or by using a top-down chamfer(e.g., edge beveling) or removable insert. The openings that can becreated using these methods may be limited to openings that can beaccomplished through a removable insert or a drilling process (e.g.,laser or mechanical drill), and do not allow complex 3-D cavities. Theseprocesses may be performed serially (e.g., drilling one hole at a time),which is time-consuming. Some components may require precise openingtolerances, such as when drilling an opening above an optical sensor.These precise tolerances may require extensive process development orthe addition of a drilling stop, such as applying a solder layer to actas a laser stop.

Thus, it is desirable to improve overmolding electronics packages whilereducing the difficulties associated with the overmolding processes.

The present subject matter includes creating structures (e.g., cavities)within an overmold by placing a sacrificial material in the mold andthen decomposing, washing, or etching away this sacrificial material.The sacrificial material can be applied to an electronics package usingvarious processes, including being dispensed, being applied through astencil print process, or being 3-D printed. The sacrificial materialcan included a preformed structure that is placed on an electronicspackage as part of an electronics package assembly process. Anelectronics package that includes this sacrificial material is thenovermolded, with little or no change needed in the overmolding process.The sacrificial material is removed following an overmolding process,such as using a thermal, chemical, optical, or other decomposingprocess.

The proposed use of sacrificial material provides technical solutions totechnical problems facing overmolded electronics packages. This proposeduse of sacrificial material reduces the technical complexity and costsassociated with the overmolding process. For example, this use ofsacrificial material allows for formation of complex 3-D cavities thatare impractical or impossible to realize using a removable insert or adrilling process. This use of sacrificial material reduces or eliminatesthe need for precise material removal tolerances. For example, insteadof requiring a solder or copper layer for a laser stop, a sacrificialmaterial may be removed completely to expose an optical sensor, aconnector, or an electrical contact (e.g., pad, land) on the electronicspackage. Additionally, multiple instances of the sacrificial materialmay be removed simultaneously, thereby replacing a serial drillingprocess with a parallel material removal manufacturing process. Theseand other features of the proposed use of sacrificial material aredescribed herein.

The following description and the drawings sufficiently illustratespecific embodiments to enable those skilled in the art to practicethem. Other embodiments may incorporate structural, logical, electrical,process, and other changes. Portions and features of some embodimentsmay be included in, or substituted for, those of other embodiments.Embodiments set forth in the claims encompass all available equivalentsof those claims.

FIGS. 1A-1D are block diagrams of sacrificial material cavity formation100, in accordance with at least one embodiment of the invention. FIGS.1A-D shows a generalized process flow for creating complex cavities andstructures, such as in an electronic package. In this embodiment, theelectronics package includes a package substrate 120, such as a printedcircuit board (PCB). The electronic package formation includes placementof electrical contacts 115 or electronics devices 105, such assurface-mount devices (SMD) placed using traditional surface-mounttechnology (SMT) manufacturing processes. One or more sacrificialmaterial structures 110 are placed on the substrate 120 or contacts 115.In an example, the sacrificial structures 110 are dispensed or placedwhen passive components or dies are placed, such as using traditionalSMT manufacturing processes. In another example, sacrificial structures110 are applied through a stencil print process or may be 3-D printed.

As shown in FIG. 1B, an overmold 125 is formed on the substrate 120,electronics devices 105, and sacrificial structures 110. For sacrificialstructures 110 designed to be decomposed using heat, the overmoldingcuring temperature, overmolding material, and sacrificial structures 110are selected to ensure the sacrificial structures 110 do not decomposeat or below the molding temperature. FIG. 1C shows the application ofsolder balls 130, such as using stencil print or ball-grid array (BGA)solder ball attachment. The process used to apply solder balls 130 isalso selected to ensure the sacrificial structures 110 do not decompose.For example, the solder attachment may use a controlled solder reflowprocess at a temperature below the thermal decomposition temperature ofthe sacrificial structures 110.

FIG. 1D shows removal of the sacrificial structures 110. Depending onthe type of material within the sacrificial structures 110, the materialis decomposed by its designated decomposition method. For example, whenthe sacrificial structures 110 include a thermally decomposablematerial, the sacrificial structures 110 may be decomposed using reflowoven (e.g., cure oven). The thermally decomposable material may beselected to have an associated thermal decomposition temperature that isbelow, at, or above a solder reflow temperature. For example, using athermal decomposition temperature below the solder reflow temperatureenables decomposition of the sacrificial structures 110 withoutreflowing solder, such as may be used to remove the sacrificialstructures 110 without disturbing solder attachments or to remove thesacrificial material and melt the solder in a single step. Conversely, athermal decomposition temperature above the solder reflow temperatureenables reflowing the solder without decomposing the sacrificialstructures 110, such as may be used to attach an SMT component withoutremoving sacrificial structures 110. In an example, solder ballattachment follows decomposition and removal of the sacrificialstructures 110. In another example, solder ball attachment is notperformed.

Multiple sacrificial structures 110 may be formed using differingmaterials to enable greater control over subsequent manufacturingprocesses. For example, differing sacrificial materials may be thermallydecomposable at different temperatures, or one sacrificial material maybe thermally decomposable and another may be chemically decomposable.Other sacrificial materials could also be used, such as ultraviolet (UV)decomposable materials, infrared (IR) decomposable materials, watersoluble materials, or other sacrificial materials. Examples ofsacrificial materials include polyalkylene copolymers, polycarbonatecopolymers, polypropylene carbonates, water soluble resins, or othersacrificial materials. The use of multiple different materials enablesgreater control over specific subsequent steps within the manufacturingprocesses. In an example, a first group of sacrificial structures 110are removed and replaced with SMT components, and a second group ofsacrificial structures 110 may be removed during a subsequentmanufacturing process step. In another example, a first sacrificialmaterial is removed and replaced with an SMT component during a firstpost-overmolding step, where a second sacrificial material is used as amechanical support or placement guide for the SMT component placement.

The removal of sacrificial structures 110 provides one or more openingswithin the overmold 125, where the openings allow for various features.In an example, the openings allow for placement of a component followingthe overmolding process. For example, this allows for placement ofcomponents that would be damaged by temperatures required during theovermolding process or SMT process, such as a thermally sensitivemagnetic component. The openings also allow for post-overmoldingplacement of components that have an associated keep-out-zone (KOZ),where the KOZ is area on the substrate 120 that must be kept vacant toallow for cooling or subsequent component mounting.

In addition to component placement, the openings provide for subsequentattachment of various connectors. The connector openings may be designedto simplify connections, such as using right-angle openings on a side ofthe substrate 120. In another example, the openings provide access toambient, such as may be required by a chemical or optical sensor.

The openings also allow for formation of versatile system-in-package(SIP) modules, where a SIP is a collection of multiple integratedcircuits integrated into a single electronics module (e.g., electronicspackage). In an example, a Global Positioning System (GPS) module isfabricated using sacrificial structures 110, an overmold 125 is appliedto obscure SIP components, and the sacrificial structures 110 areremoved to reveal SIP-to-PCB or SIP-to-SIP connectors.

Though FIG. 1D shows openings with rectangular cross sections, morecomplex shapes may be used to provide additional features. For example,in the case of the connector, a sacrificial structure 110 may create amechanical interference (e.g., tab, key) such that only specificconnectors may be used, or such that a connector only fits in a specificorientation. In a similar example, a sacrificial structure 110 providesa device-specific mechanical interference to ensure device compatibilityor reduce unintended or unauthorized use. For example, a specific boardconfiguration may be used in various versions of a smartphone, where aspecific subset of sacrificial structures 110 may be removed for eachversion of the smartphone to attach a different set of sensors orconnectors. Additionally, the sacrificial structures 110 may be removedby using a specific dissolution chemical or multiple-step process, wherethe chemical or multiple-step process is only provided to authorizedmanufacturers or integrators. In various examples, sacrificial materialcavity formation 100 is used to form a single package or multiplepackages, where multiple packages may be created in a linear strip or2-D array and subsequently singulated (e.g., separated). Additionalstructures or channels may be formed, such as shown in FIG. 2.

FIG. 2 is a block diagram of complex channel cavity formation 200, inaccordance with at least one embodiment of the invention. In contrastwith other drilling methods that create linear openings, the use of asacrificial layer can be used to create complex channels, such as usingmultiple smaller channels (e.g., microchannels) to provide access toambient. In this embodiment, the electronic package formation includesattaching solder balls 230 and one or more electronic components 205 topackage substrate 220. A first electronic component 205A and component235 is attached to the package substrate 220. The component 235 mayinclude an ambient-sensitive electronic component, a thermogenic IC diethat requires a cooling channel, or other component 235. Followingplacement of component 235, a first overmold 225A is applied to thefirst electronic component 205A and ambient-sensitive component 235. Asacrificial layer 210 is applied to the first overmold 225A and theambient-sensitive component 235. In an example, for complex (e.g.,multi-channel) or large sacrificial layer 210 geometries that aredifficult to produce using stencil printing, the sacrificial layer 210is preformed using a mold, a stamping method, or alternative sacrificiallayer 210 formation process.

Various techniques may be used to detect the use of a sacrificialmaterial. In an example, the complexity of the channel is used todetermine if a product was formed using methods described herein. Someexisting industry approaches have associated features, such as drillingin a straight line or using a molding feature (e.g., a tab) that isextracted when the mold is removed. In an example, the use of asacrificial material is detectable by examining the shape of anelongated chamber, such as by identifying multiple bends (e.g., multipleinflection points) or sharp angles (e.g., 90 degrees or greater) may notbe possible by drilling. In an example, the use of a sacrificialmaterial is detectable by examining the geometry of a chamber, such asby examining wall chamfers (e.g., inner edge beveling). For example, asacrificial material may be used to generate a chamber whose lowerportion is wider than the upper portion from which the sacrificialmaterial is removed, but a non-sacrificial material used in the samechamber would not be able to be extracted. In an example, varioussurfaces are examined to identify materials used in the sacrificialmaterial deposition and removal process. For example, the sacrificialmaterial removal process may leave traces of the sacrificial material,or may leave traces of the chemicals used to remove the sacrificialmaterial or rinse the chamber. In an example, a material is added to thesacrificial material to enhance detectability, where the material may beselected to not be removable by the same removal process as used inremoving the sacrificial material.

Following application of the sacrificial layer 210, a second electroniccomponent 205B is applied to the sacrificial layer 210, and a secondovermold 225B is applied to the sacrificial layer 210 and to secondelectronic component 205B. Finally, the sacrificial layer 210 is removedto produce a complex cavity adjacent to the ambient-sensitive component235. In an example, the area previously occupied by the sacrificiallayer 210 is left open to ambient, such as when using air to provide adesired index of refraction at the device-air boundary of component 235.In another example, the area previously occupied by the sacrificiallayer 210 is filled with a material with specific properties, such as anelectrically conductive dielectric paste or thermally conductive thermalinterface material (TIM). In an example, various intermediate steps ofthe complex channel cavity formation 200 may be used to provide a devicethat includes an exposed sacrificial layer 210. For example, followingthe placement of the second electronic component 205B or the secondovermold 225B, the resulting device includes sacrificial layer 210 thatis exposed on at least two ends. This intermediate step allows for laterapplication of an electronic device or a different type of overmold, andprovides electrical and physical isolation of the first electroniccomponent 205A.

The sacrificial layer 210 geometry, overmolds 225A and 225B, and variousother components are organized to provide an escape path for thedissolving sacrificial layer 210. The escape path may include aventilation path for gas to escape, a leakage path for a solution toescape, a channel through which a dissolving or cleaning material ispassed, or a combination of escape paths. Additionally, overmolds 225Aand 225B or other components may be formed using organic or othermaterials that allow for diffusion of materials from dissolving thesacrificial layer 210. The escape or diffusion path is selected to becompatible with the sacrificial material, and multiple different pathsmay be select to correspond to multiple different types of sacrificialmaterials. The escape path or sacrificial material may be selected suchthat not all of the sacrificial material is removed. For example, thesacrificial material may include a thermally conductive material or acorrosion-retardant material, where the removal of the sacrificialmaterial results in application of the thermally conductive orcorrosion-retardant material to an internal surface. In other example, asacrificial material may include a marking substance to detect the useof the specific sacrificial material or removal method, where theremoval of the sacrificial material results in application of themarking substance to an internal surface.

FIGS. 3A-3B are block diagrams of a cavity formation application 300, inaccordance with at least one embodiment of the invention. The cavityformation application 300 shown in FIGS. 3A-3B includes using asacrificial material to form thermally conductive vents, such as thoseused in complex finned or channeled heat sinks. Application 300 includesapplying solder 330, electronic components 305, and a thermogeniccomponent 335 onto a substrate 320. Sacrificial structures 310 aredisposed on the thermogenic component 335, and an overmold 325 isapplied, resulting in the structure shown in FIG. 3A.

In an example, following application of the overmold 325, thesacrificial structures 310 are removed, and thermally conductivestructures 315 are disposed within the voids to conduct heat away fromthe thermogenic component 335. The thermally conductive structures 315may be preformed structures attached to the walls of the overmold 325,or may include a thermally conductive material sputtered or vacuuminjected into the cavity left by the removal of the sacrificialstructures 310. In another example, the thermally conductive structures315 are applied to sacrificial structures 310 before placement ofsacrificial structures 310, such as by sputtering the sacrificialstructures 310 with copper or another metal. In another example, thesacrificial structures 310 may be formed within thermally conductivestructures 315, such as by injecting a sacrificial material within athermally conductive shell.

FIG. 4A-4C are block diagrams of complex cavity formation 400, inaccordance with at least one embodiment of the invention. Complex cavityformation 400 includes forming a complex sacrificial structure 440, suchas the threaded screw shown in FIG. 4A. As shown in FIG. 4B, the complexsacrificial structure 440 and electronic components 405 are applied to apackage substrate 420. An overmold 425 is formed around the complexsacrificial structure 440 and electronic components 405. The complexsacrificial structure 440 is removed, resulting in the formation of thecomplex cavity shown in FIG. 4C. In an example, the complex cavityformation 400 is used to form a mechanical guide, such as may be used toattach an external device to overmold 425 using a screw. In anotherexample, the complex cavity formation 400 is used to form an electricalconnection, such as may be used to attach a grounding screw through theovermold 425 to the package substrate 420.

FIG. 5 is a flowchart of a complex cavity application method 500, inaccordance with at least one embodiment of the invention. Method 500includes placing 510 a sacrificial material on or within an electronicspackage. The sacrificial material is placed on a substrate, anelectronic component, or another surface. In various examples, thesacrificial material is dispensed, applied through a stencil printprocess, 3-D printed, or applied using another application process. Anovermold is applied 520 to the sacrificial material and electronicspackage. The sacrificial material is removed 530, such as bydecomposing, washing, or etching away this sacrificial material,resulting in a cavity or channel.

FIG. 6 is a block diagram of an electronic device incorporating acomplex cavity apparatus or method 600, in accordance with at least oneembodiment of the invention. FIG. 6 shows an example of an electronicdevice using semiconductor chip assemblies and solders as described inthe present disclosure is included to show an example of a higher-leveldevice application for the present invention. Electronic device 600 ismerely one example of an electronic system in which embodiments of thepresent invention can be used. Examples of electronic devices 600include, but are not limited to personal computers, tablet computers,mobile telephones, game devices, MP3 or other digital music players,etc. In this example, electronic device 600 comprises a data processingsystem that includes a system bus 602 to couple the various componentsof the system. System bus 602 provides communications links among thevarious components of the electronic device 600 and can be implementedas a single bus, as a combination of busses, or in any other suitablemanner.

An electronic assembly 610 is coupled to system bus 602. The electronicassembly 610 can include any circuit or combination of circuits. In oneembodiment, the electronic assembly 610 includes a processor 612 thatcan be of any type. As used herein, “processor” means any type ofcomputational circuit, such as but not limited to a microprocessor, amicrocontroller, a complex instruction set computing (CISC)microprocessor, a reduced instruction set computing (RISC)microprocessor, a very long instruction word (VLIW) microprocessor, agraphics processor, a digital signal processor (DSP), multiple coreprocessor, or any other type of processor or processing circuit.

Other types of circuits that can be included in electronic assembly 610are a custom circuit, an application-specific integrated circuit (ASIC),or the like, such as, for example, one or more circuits (such as acommunications circuit 614) for use in wireless devices like mobiletelephones, personal data assistants, portable computers, two-wayradios, and similar electronic systems. The IC can perform any othertype of function.

The electronic device 600 can also include an external memory 620, whichin turn can include one or more memory elements suitable to theparticular application, such as a main memory 622 in the form of randomaccess memory (RAM), one or more hard drives 624, and/or one or moredrives that handle removable media 626 such as compact disks (CD), flashmemory cards, digital video disk (DVD), and the like.

The electronic device 600 can also include a display device 616, one ormore speakers 618, and a keyboard and/or controller 630, which caninclude a mouse, trackball, touch screen, voice-recognition device, orany other device that permits a system user to input information intoand receive information from the electronic device 600.

To better illustrate the method and apparatuses disclosed herein, anon-limiting list of embodiments is provided here:

Example 1 is a method comprising: disposing a sacrificial material on anelectrical component; disposing an overmold on the sacrificial material;and removing the sacrificial material.

In Example 2, the subject matter of Example 1 optionally includeswherein the electronic component is disposed on a printed circuit board(PCB).

In Example 3, the subject matter of any one or more of Examples 1-2optionally include wherein the electronic component includes an opticalelectronic component.

In Example 4, the subject matter of Example 3 optionally includeswherein the overmold includes a material selected to provide a desiredoptical property to the optical electronic component.

In Example 5, the subject matter of any one or more of Examples 1-4optionally include wherein the overmold includes a material selected toprovide a desired structural property.

In Example 6, the subject matter of Example 5 optionally includeswherein the desired structural property includes avoiding warpingfollowing removal of the sacrificial material.

In Example 7, the subject matter of any one or more of Examples 1-6optionally include wherein the electronic component includes athermogenic electronic component.

In Example 8, the subject matter of Example 7 optionally includeswherein the thermogenic electronic component includes a processor.

In Example 9, the subject matter of any one or more of Examples 1-8optionally include wherein: the sacrificial material includes a firstportion proximate to the electronic component and a second portionproximate to the overmold; and the first portion is wider than thesecond portion.

In Example 10, the subject matter of any one or more of Examples 1-9optionally include wherein the sacrificial material includes a channel.

In Example 11, the subject matter of Example 10 optionally includeswherein the channel is nonlinear.

In Example 12, the subject matter of Example 11 optionally includeswherein the nonlinear channel includes multiple paths.

In Example 13, the subject matter of any one or more of Examples 10-12optionally include wherein the channel includes a first opening tofacilitate removal of the sacrificial material.

In Example 14, the subject matter of Example 13 optionally includeswherein the channel includes a second opening to provide a flow pathbetween the first opening and the second opening.

In Example 15, the subject matter of any one or more of Examples 1-14optionally include wherein the sacrificial material includes a preformedsacrificial object.

In Example 16, the subject matter of Example 15 optionally includeswherein: the sacrificial object is formed in the shape of a device to beinstalled in the overmold; and the removal of the sacrificial materialcreates a receptacle for the device.

In Example 17, the subject matter of any one or more of Examples 1-16optionally include wherein removing the sacrificial material includesapplying an optical process to the sacrificial material.

In Example 18, the subject matter of any one or more of Examples 1-17optionally include wherein removing the sacrificial material includesapplying heat to the sacrificial material.

In Example 19, the subject matter of any one or more of Examples 1-18optionally include wherein removing the sacrificial material includesapplying a chemical process to dissolve the sacrificial material.

In Example 20, the subject matter of any one or more of Examples 1-19optionally include wherein removing the sacrificial material exposes athermal channel.

In Example 21, the subject matter of Example 20 optionally includesapplying a thermally conductive material to the exposed thermal channel.

In Example 22, the subject matter of any one or more of Examples 1-21optionally include wherein removing the sacrificial material exposes anelectrical contact.

In Example 23, the subject matter of any one or more of Examples 1-22optionally include wherein removing the sacrificial material exposes anoptical component.

Example 24 is a machine-readable medium including instructions, whichwhen executed by a computing system, cause the computing system toperform any of the methods of Examples 1-23.

Example 25 is an apparatus comprising means for performing any of themethods of Examples 1-23.

Example 26 is an apparatus comprising: an electronic component; anovermold disposed on the electronic component; and a cavity adjacent toat least a portion of the electronic component, the cavity formed fromthe removal of a sacrificial material previously disposed on theelectronic component.

In Example 27, the subject matter of Example 26 optionally includeswherein the electronic component is disposed on a printed circuit board(PCB).

In Example 28, the subject matter of any one or more of Examples 26-27optionally include wherein the electronic component includes an opticalelectronic component.

In Example 29, the subject matter of Example 28 optionally includeswherein the overmold includes a material selected to provide a desiredoptical property to the optical electronic component.

In Example 30, the subject matter of any one or more of Examples 26-29optionally include wherein the overmold includes a material selected toprovide a desired structural property.

In Example 31, the subject matter of Example 30 optionally includeswherein the desired structural property includes avoiding warpingfollowing removal of the sacrificial material.

In Example 32, the subject matter of any one or more of Examples 26-31optionally include wherein the electronic component includes athermogenic electronic component.

In Example 33, the subject matter of Example 32 optionally includeswherein the thermogenic electronic component includes a processor.

In Example 34, the subject matter of any one or more of Examples 26-33optionally include wherein: the cavity includes a first portionproximate to the substrate and a second portion proximate to theovermold; and the first portion is wider than the second portion.

In Example 35, the subject matter of any one or more of Examples 26-34optionally include wherein the cavity includes a channel structure.

In Example 36, the subject matter of Example 35 optionally includeswherein the channel structure is nonlinear.

In Example 37, the subject matter of Example 36 optionally includeswherein the nonlinear channel structure includes multiple paths.

In Example 38, the subject matter of any one or more of Examples 35-37optionally include wherein the channel includes a first opening tofacilitate removal of the sacrificial material.

In Example 39, the subject matter of Example 38 optionally includeswherein the channel includes a second opening to provide a flow pathbetween the first opening and the second opening.

In Example 40, the subject matter of any one or more of Examples 26-39optionally include wherein: the cavity is formed in the shape of adevice to be installed in the overmold; and the cavity formed from theremoval of the sacrificial material forms a receptacle for the device.

In Example 41, the subject matter of any one or more of Examples 26-40optionally include wherein the cavity includes a thermal channel.

In Example 42, the subject matter of Example 41 optionally includes athermally conductive material disposed in the thermal channel.

In Example 43, the subject matter of any one or more of Examples 26-42optionally include wherein the cavity includes an electrical contactexposed by removing the sacrificial material.

In Example 44, the subject matter of any one or more of Examples 26-43optionally include wherein the cavity includes an optical componentexposed by removing the sacrificial material.

Example 45 is an apparatus comprising: an electronic component; asacrificial material disposed on the electronic component, thesacrificial material being removable to provide a cavity; and anovermold disposed on the sacrificial material.

In Example 46, the subject matter of Example 45 optionally includeswherein the electronic component is disposed on a printed circuit board(PCB).

In Example 47, the subject matter of any one or more of Examples 45-46optionally include wherein the electronic component includes an opticalelectronic component.

In Example 48, the subject matter of Example 47 optionally includeswherein the overmold includes a material selected to provide a desiredoptical property to the optical electronic component.

In Example 49, the subject matter of any one or more of Examples 45-48optionally include wherein the overmold includes a material selected toprovide a desired structural property.

In Example 50, the subject matter of Example 49 optionally includeswherein the desired structural property includes avoiding warpingfollowing removal of the sacrificial material.

In Example 51, the subject matter of any one or more of Examples 45-50optionally include wherein the electronic component includes athermogenic electronic component.

In Example 52, the subject matter of Example 51 optionally includeswherein the thermogenic electronic component includes a processor.

In Example 53, the subject matter of any one or more of Examples 45-52optionally include wherein: the sacrificial material includes a firstportion proximate to the substrate and a second portion proximate to theovermold; and the first portion is wider than the second portion.

In Example 54, the subject matter of any one or more of Examples 45-53optionally include wherein the sacrificial material includes a channelstructure.

In Example 55, the subject matter of Example 54 optionally includeswherein the channel structure is nonlinear.

In Example 56, the subject matter of Example 55 optionally includeswherein the nonlinear channel structure includes multiple paths.

In Example 57, the subject matter of any one or more of Examples 54-56optionally include wherein the channel includes a first opening tofacilitate removal of the sacrificial material.

In Example 58, the subject matter of Example 57 optionally includeswherein the channel includes a second opening to provide a flow pathbetween the first opening and the second opening.

In Example 59, the subject matter of any one or more of Examples 45-58optionally include wherein the sacrificial material includes a preformedsacrificial object.

In Example 60, the subject matter of Example 59 optionally includeswherein: the sacrificial object is formed in the shape of a device to beinstalled in the overmold; and the cavity formed from the removal of thesacrificial material forms a receptacle for the device.

In Example 61, the subject matter of any one or more of Examples 45-60optionally include wherein the sacrificial material includes a materialthat is removable by an optical process.

In Example 62, the subject matter of any one or more of Examples 45-61optionally include wherein the sacrificial material includes a materialthat is removable by a thermal process.

In Example 63, the subject matter of any one or more of Examples 45-62optionally include wherein the sacrificial material includes a materialthat is removable by a chemical process.

In Example 64, the subject matter of any one or more of Examples 45-63optionally include wherein the cavity includes a thermal channel.

In Example 65, the subject matter of Example 64 optionally includes athermally conductive material disposed in the thermal channel.

In Example 66, the subject matter of any one or more of Examples 45-65optionally include wherein the cavity includes an electrical contactexposed by removing the sacrificial material.

In Example 67, the subject matter of any one or more of Examples 45-66optionally include wherein the cavity includes an optical componentexposed by removing the sacrificial material.

Example 68 is at least one machine-readable storage medium, comprising aplurality of instructions that, responsive to being executed withprocessor circuitry of a computer-controlled device, cause thecomputer-controlled device to: dispose a sacrificial material on anelectrical component; dispose an overmold on the sacrificial material;and remove the sacrificial material.

In Example 69, the subject matter of Example 68 optionally includeswherein the electronic component is disposed on a printed circuit board(PCB).

In Example 70, the subject matter of any one or more of Examples 68-69optionally include wherein the electronic component includes an opticalelectronic component.

In Example 71, the subject matter of Example 70 optionally includeswherein the overmold includes a material selected to provide a desiredoptical property to the optical electronic component.

In Example 72, the subject matter of any one or more of Examples 68-71optionally include wherein the overmold includes a material selected toprovide a desired structural property.

In Example 73, the subject matter of Example 72 optionally includeswherein the desired structural property includes avoiding warpingfollowing removal of the sacrificial material.

In Example 74, the subject matter of any one or more of Examples 68-73optionally include wherein the electronic component includes athermogenic electronic component.

In Example 75, the subject matter of Example 74 optionally includeswherein the thermogenic electronic component includes a processor.

In Example 76, the subject matter of any one or more of Examples 68-75optionally include wherein: the sacrificial material includes a firstportion proximate to the electronic component and a second portionproximate to the overmold; and the first portion is wider than thesecond portion.

In Example 77, the subject matter of any one or more of Examples 68-76optionally include wherein the sacrificial material includes a channel.

In Example 78, the subject matter of Example 77 optionally includeswherein the channel is nonlinear.

In Example 79, the subject matter of Example 78 optionally includeswherein the nonlinear channel includes multiple paths.

In Example 80, the subject matter of any one or more of Examples 77-79optionally include wherein the channel includes a first opening tofacilitate removal of the sacrificial material.

In Example 81, the subject matter of Example 80 optionally includeswherein the channel includes a second opening to provide a flow pathbetween the first opening and the second opening.

In Example 82, the subject matter of any one or more of Examples 68-81optionally include wherein the sacrificial material includes a preformedsacrificial object.

In Example 83, the subject matter of Example 82 optionally includeswherein: the sacrificial object is formed in the shape of a device to beinstalled in the overmold; and the removal of the sacrificial materialcreates a receptacle for the device.

In Example 84, the subject matter of any one or more of Examples 68-83optionally include wherein removing the sacrificial material includesapplying an optical process to the sacrificial material.

In Example 85, the subject matter of any one or more of Examples 68-84optionally include wherein removing the sacrificial material includesapplying heat to the sacrificial material.

In Example 86, the subject matter of any one or more of Examples 68-85optionally include wherein removing the sacrificial material includesapplying a chemical process to dissolve the sacrificial material.

In Example 87, the subject matter of any one or more of Examples 68-86optionally include wherein removing the sacrificial material exposes athermal channel.

In Example 88, the subject matter of Example 87 optionally includes theinstructions further causing the computer-controlled device to applyinga thermally conductive material to the exposed thermal channel.

In Example 89, the subject matter of any one or more of Examples 68-88optionally include wherein removing the sacrificial material exposes anelectrical contact.

In Example 90, the subject matter of any one or more of Examples 68-89optionally include wherein removing the sacrificial material exposes anoptical component.

Example 91 is an apparatus comprising: means for disposing a sacrificialmaterial on an electrical component; means for disposing an overmold onthe sacrificial material; and means for removing the sacrificialmaterial.

In Example 92, the subject matter of Example 91 optionally includeswherein the electronic component is disposed on a printed circuit board(PCB).

In Example 93, the subject matter of any one or more of Examples 91-92optionally include wherein the electronic component includes an opticalelectronic component.

In Example 94, the subject matter of Example 93 optionally includeswherein the overmold includes a material selected to provide a desiredoptical property to the optical electronic component.

In Example 95, the subject matter of any one or more of Examples 91-94optionally include wherein the overmold includes a material selected toprovide a desired structural property.

In Example 96, the subject matter of Example 95 optionally includeswherein the desired structural property includes avoiding warpingfollowing removal of the sacrificial material.

In Example 97, the subject matter of any one or more of Examples 91-96optionally include wherein the electronic component includes athermogenic electronic component.

In Example 98, the subject matter of Example 97 optionally includeswherein the thermogenic electronic component includes a processor.

In Example 99, the subject matter of any one or more of Examples 91-98optionally include wherein: the sacrificial material includes a firstportion proximate to the electronic component and a second portionproximate to the overmold; and the first portion is wider than thesecond portion.

In Example 100, the subject matter of any one or more of Examples 91-99optionally include wherein the sacrificial material includes a channel.

In Example 101, the subject matter of Example 100 optionally includeswherein the channel is nonlinear.

In Example 102, the subject matter of Example 101 optionally includeswherein the nonlinear channel includes multiple paths.

In Example 103, the subject matter of any one or more of Examples100-102 optionally include wherein the channel includes a first openingto facilitate removal of the sacrificial material.

In Example 104, the subject matter of Example 103 optionally includeswherein the channel includes a second opening to provide a flow pathbetween the first opening and the second opening.

In Example 105, the subject matter of any one or more of Examples 91-104optionally include wherein the sacrificial material includes a preformedsacrificial object.

In Example 106, the subject matter of Example 105 optionally includeswherein: the sacrificial object is formed in the shape of a device to beinstalled in the overmold; and the removal of the sacrificial materialcreates a receptacle for the device.

In Example 107, the subject matter of any one or more of Examples 91-106optionally include wherein means for removing the sacrificial materialincludes means for applying an optical process to the sacrificialmaterial.

In Example 108, the subject matter of any one or more of Examples 91-107optionally include wherein means for removing the sacrificial materialincludes means for applying heat to the sacrificial material.

In Example 109, the subject matter of any one or more of Examples 91-108optionally include wherein means for removing the sacrificial materialincludes means for applying a chemical process to dissolve thesacrificial material.

In Example 110, the subject matter of any one or more of Examples 91-109optionally include wherein means for removing the sacrificial materialexposes a thermal channel.

In Example 111, the subject matter of Example 110 optionally includesapplying a thermally conductive material to the exposed thermal channel.

In Example 112, the subject matter of any one or more of Examples 91-111optionally include wherein means for removing the sacrificial materialexposes an electrical contact.

In Example 113, the subject matter of any one or more of Examples 91-112optionally include wherein means for removing the sacrificial materialexposes an optical component.

The above detailed description includes references to the accompanyingdrawings, which form a part of the detailed description. The drawingsshow, by way of illustration, specific embodiments in which theinvention can be practiced. These embodiments are also referred toherein as “examples.” Such examples can include elements in addition tothose shown or described. However, the present inventors alsocontemplate examples in which only those elements shown or described areprovided. Moreover, the present inventors also contemplate examplesusing any combination or permutation of those elements shown ordescribed (or one or more aspects thereof), either with respect to aparticular example (or one or more aspects thereof), or with respect toother examples (or one or more aspects thereof) shown or describedherein.

In this document, the terms “a” or “an” are used, as is common in patentdocuments, to include one or more than one, independent of any otherinstances or usages of “at least one” or “one or more.” In thisdocument, the term “or” is used to refer to a nonexclusive or, such that“A or B” includes “A but not B,” “B but not A,” and “A and B,” unlessotherwise indicated. In this document, the terms “including” and “inwhich” are used as the plain-English equivalents of the respective terms“comprising” and “wherein.” Also, in the following claims, the terms“including” and “comprising” are open-ended, that is, a system, device,article, composition, formulation, or process that includes elements inaddition to those listed after such a term in a claim are still deemedto fall within the scope of that claim. Moreover, in the followingclaims, the terms “first,” “second,” and “third,” etc. are used merelyas labels, and are not intended to impose numerical requirements ontheir objects.

The above description is intended to be illustrative, and notrestrictive. For example, the above-described examples (or one or moreaspects thereof) may be used in combination with each other. Otherembodiments can be used, such as by one of ordinary skill in the artupon reviewing the above description. The Abstract is provided to complywith 37 C.F.R. §1.72(b), to allow the reader to quickly ascertain thenature of the technical disclosure. It is submitted with theunderstanding that it will not be used to interpret or limit the scopeor meaning of the claims. In the above Detailed Description, variousfeatures may be grouped together to streamline the disclosure. Thisshould not be interpreted as intending that an unclaimed disclosedfeature is essential to any claim. Rather, inventive subject matter maylie in less than all features of a particular disclosed embodiment.Thus, the following claims are hereby incorporated into the DetailedDescription, with each claim standing on its own as a separateembodiment, and it is contemplated that such embodiments can be combinedwith each other in various combinations or permutations. The scope ofthe invention should be determined with reference to the appendedclaims, along with the full scope of equivalents to which such claimsare entitled.

1. A method comprising: disposing a sacrificial material on anelectronic component, the electronic component disposed on a printedcircuit board (PCB); disposing an overmold on the sacrificial material;and removing the sacrificial material.
 2. (canceled)
 3. The method ofclaim 1, wherein: the sacrificial material includes a first portionproximate to the electronic component and a second portion proximate tothe overmold; and the first portion is wider than the second portion. 4.The method of claim 1, wherein the sacrificial material includes achannel.
 5. The method of claim 4, wherein the channel is nonlinear. 6.The method of claim 1, wherein the sacrificial material includes apreformed sacrificial object.
 7. The method of claim 6, wherein: thesacrificial object is formed in the shape of a device to be installed inthe overmold; and the removal of the sacrificial material creates areceptacle for the device.
 8. An apparatus comprising: an electroniccomponent disposed on a printed circuit hoard (PCB); an overmolddisposed on the electronic component; and a cavity adjacent to at leasta portion of the electronic component, the cavity formed from theremoval of a sacrificial material previously disposed on the electroniccomponent.
 9. (canceled)
 10. The apparatus of claim 8, wherein theelectronic component includes an optical electronic component.
 11. Theapparatus of claim 10, wherein the overmold includes a material selectedto provide a desired optical property to the optical electroniccomponent.
 12. The apparatus of claim 8, wherein the overmold includes amaterial selected to provide a desired structural property.
 13. Theapparatus of claim 8, wherein: the cavity includes a first portionproximate to the substrate and a second portion proximate to theovermold; and the first portion is wider than the second portion. 14.The apparatus of claim 8, wherein the cavity includes a channelstructure.
 15. The apparatus of claim 8, wherein: the cavity is formedin the shape of a device to be installed in the overmold; and the cavityformed from the removal of the sacrificial material forms a receptaclefor the device.
 16. An apparatus comprising: an electronic componentdisposed on a printed circuit board (PCB); a sacrificial materialdisposed on the electronic component, the sacrificial material beingremovable to provide a cavity; and an overmold disposed on thesacrificial material.
 17. (canceled)
 18. The apparatus of claim 16,wherein the electronic component includes an optical electroniccomponent.
 19. The apparatus of claim 18, wherein the overmold includesa material selected to provide a desired optical property to the opticalelectronic component.
 20. The apparatus of claim 16, wherein theovermold includes a material selected to provide a desired structuralproperty.
 21. The apparatus of claim 16, wherein: the sacrificialmaterial includes a first portion proximate to substrate and a secondportion proximate to the overmold; and the first portion is wider thanthe second portion.
 22. The apparatus of claim 16, wherein thesacrificial material includes a channel structure.
 23. The apparatus ofclaim 16, wherein the sacrificial material includes a preformedsacrificial object.
 24. The apparatus of claim 23, wherein: thesacrificial object is formed in the shape of a device to be installed inthe overmold; and the cavity formed from the removal of the sacrificialmaterial forms a receptacle for the device.